Characteristics

Solderable Aluminum Sheets (SAPlate)

Solder wettability equal to copper and tin is gained for both flow soldering and reflow soldering.

Soldering Characteristics Graph
Rate of wettability increase (%) Reflow soldering wettability increase

Radiation equal to extruded materials is gained at only 1/3 the weight.

Radiation Graph
Semiconductor Temperature (degree centigrade) Radiation characteristics when embedded to actual product