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Cladding Materials (FINE CLAD)
Application Examples
Introduce examples of high density mounting substrates (IC packaged substrate, printed circuit board bump, and circuit molding material).Configuration
Cu (Circuit Foil)/Ni (Etching Stopper Layer)/Cu (Bump Substrate)
(Manufactured Using Ni Plated Copper Foil & Copper Foil Clad)
Features
- Micro bumps (metal protrusions) at uniform heights can be batch formed through selecting copper for etching.
- Small diameter bumps (Less than φ150 µm) can be formed, enabling veer (interlayer connection) miniaturization.
- A uniform foil thickness enables a microcircuit pattern form.
- It can be used in the manufacturing process of a variety of printed board types.
Specifications
| Copper-A For Bumps |
Nickel Layer Etching Stopper |
Copper-B For Circuits |
|
|---|---|---|---|
| Type | Rolled Copper Foil | Electroplating | Electrolytic Copper Foil |
| Materials | Pure Copper (C1020) Copper ±99.96% |
Pure Nickel | Pure Copper 99.8% |
| Thickness Range | 50 to 125 µm*1 | 0.8 to 1.0 µm*1 | 18 to 35 µm*2 |
| Current Specifications | 80, 100, 125 µm | 0.8 µm | 18, 25 µm |
| Thickness Tolerance | ±7 µm | ±0.1 µm | ±1.2 µm |
| Ra | 0.05 µm | - | 0.25 µm |
| Tensile Strength | >275 N/mm² | - | 370 N/mm² |
* 1:Actual Thickness * 2: Nominal Thickness
Basic Application Method
- When the thick copper side is etched, bumps can be formed, and when the thin copper side is etched, circuits can be formed.
Remaining layers after etching perform a support function in either situation. - This etching method enabled bumps to be batch formed at small diameters and uniform heights.
Thin-type Package Uses
- Example of uses for plastic mold type multi-pin packages not using resin substrates (QFN, LGA).
- A unique thin-type package is enabled by using the temporary support function (Note 1) (Prototype achieved 0.25 mmt minimum thinness).
(Note 1) Temporary Support: Enables functions to supplement strength deficiencies due to thinness then is ultimately removed.
- Contents: Coreless, Resin Mold Third-less Package (SON, QFN, LGA, etc.)
- Package Highlights: Thinness (Current 0.8 mmt → Minimum 0.25 mmt), design variations
- Clad Material Function: Temporary support function + terminal
- Enables full package thinness
- No need for temporary support lamination process.
- Enables Batch Mold Method (Molded Array Packaging) Uses
- Enables electrical characteristics checks before separate side cuts after molding
- Only resin is cut at PKG dicing, improving productivity
- Terminal array (wiring) can be set freely
(SON, QFN, LGA, etc., 1, 2, multiple array terminals available)
Multilayer Substrate Uses (Flexible Substrate Use)
- Multilayer substrate use possible through bump formation, resin lamination, copper foil lamination and circuit formation.
Other Packaged Substrate Prototype Examples
"FINE CLAD" is a high function bimetallic lamination material manufactured through vacuum pressure welding using a surface activation sealing method, an ambient temperature sealing technology. It features ultra thin metal foil lamination availability, sealant phase flatness and no alloy layer. The use of unique etching technology enables 3D microstructure formation using fine clad, and is used in semiconductor mounting substrate application requiring 3D copper foil wiring for lightweight, thinness and shortness. We will proactively deploy to these applications in the future.
- Packaged Substrate Prototype Example A (Bumped Wiring)
- Packaged Substrate Prototype Example B (4-layer Substrate)
